Emil Otto further expands its product portfolio of the alcohol and water-based flux series EO-Y-006

The German flux manufacturer Emil Otto GmbH is further expanding its product range with the fluxes EO-Y-006 A and C. Both flux versions are now available to customers and further diversify Emil Otto's product portfolio.

"All versions of the EO-Y-006 series consist of 60% alcohol and 40 % water. However, the fluxes EO-Y-006 A and C differ in their solids content and acid number. The flux EO-Y-006 A has a solids content of 1.9 to 2.2%, whereas C has a higher solids content of 3.9 to 4.2%. EO-Y-006, which was previously available on the market, now becomes EO-Y-006Bwith an unchanged solids content of 3.0 to 3.2%," explains Markus Geßner, Head of Marketing and Sales at Emil Otto GmbH. The new products further expand the range of hybrid fluxes and are tailored to customer requirements. "These fluxes achieve very good soldering results due to their alcohol-water-based formulation and the PCB is very clean after using the fluxes. All variants of the EO-Y-006 series are suitable for use on Organic Solderability Preservative (OPS) printed circuit boards," continues Geßner. The fluxes were developed for use in wave and selective soldering. They can also be used for manual and repair soldering as well as dip soldering. The very good soldering properties are particularly evident when soldering through and wetting the circuit board.

The individual variants of EO-Y-006 allow customers to select a flux that is customised to their area of application. The A variant has a low solids content of around 2% and was specially developed for full tunnel nitrogen applications. The flux guarantees very good soldering results under full nitrogen due to its wide process window and high temperature stability. The standard version corresponds to the B variant, which has a solids content of around 3%. This version of the EO-Y-006 is also available as a dosing pen or dosing bottle. The third version is the C variant, which was specially developed for power electronics where large component bodies have to be soldered with a high placement density.